Prof. Jinsong Leng, Prof. Yanju Liu, Prof. Liwu Liu and Dr. Yang He attended SPIE Smart Structures+ Nondestructive Evaluation, which was held from March 4–8, 2018 in Denver, Colorado, United States. SPIE Smart Structures + Nondestructive Evaluation is the largest international meeting on smart materials, sensor networks, nondestructive evaluation and structural health monitoring. Over 700 researchers and engineers from 40+ countries gathered to share insights on these emerging technologies and industry developments this year.

Our group members did not only deliver excellent oral and poster presentations on smart structures but also attend ‘20thAnnual EAP-In-Action Session and Demonstrations’ and ‘3D Printing Demonstration Session’. It was a great honor and experience for them to demonstrate the results of our progress in dielectric elastomer actuator and 4D printing technology, which caused strong echo among participants.