Prof. Yanju Liu, Prof. Liwu Liu, Mr. Jinrong Li, Mr. Guanghua Hou, Mr. Hongwei Liu attended SPIE Smart Structures+ Nondestructive Evaluation, which was held from March 3–7, 2019 in Denver, Colorado, United States. SPIE Smart Structures + Nondestructive Evaluation is the largest international meeting on smart materials, sensor networks, nondestructive evaluation and structural health monitoring. Over 800 researchers and engineers from 40+ countries gathered to share insights on these emerging technologies and industry developments this year.

Our group members did not only deliver excellent oral and poster presentations on smart structures but also attend ‘Annual EAP-In-Action Session and Demonstrations’. It was a great honor and experience for them to demonstrate the results of our progress in dielectric elastomer actuator, which caused strong echo among participants.